| Current–voltage, room-temperature Schottky barrier | 0.40–0.50 eV |
|---|---|
| Current–voltage, room-temperature diode ideality factor | 1.6–1.8 |
| Current–voltage, room-temperature reverse bias | Current magnitude increased linearly with applied reverse-bias voltage instead of converging to the reverse-bias saturation current |
| Mott–Schottky ZnO dopant density | 10¹⁴–10¹⁶ cm⁻³ |
| Mott–Schottky built-in potential | 0.6–0.9 eV |
| Bulk ZnO Fermi-level–conduction-band energy separation | Approximately 0.15 eV |
| Capacitance–voltage Schottky barrier | 0.75–1.05 eV |
| Estimated zero-bias depletion-layer thickness | 80–200 nm |
| Current–voltage and Mott–Schottky, ambient-pressure N2 or CO2 thermal cycling | The junction remained rectifying with increasing reverse-bias current at increasing temperature and no irreversible changes; the 0.42 eV Schottky barrier and approximately 4 × 10¹⁶ cm⁻³ dopant density persisted |
| Current–voltage, 20 % H2 in N2 or CO2 at 250 °C and cooling under the same atmosphere | The junction became ohmic and remained ohmic |
| Current–voltage, room-temperature N2 storage after 20 % H2 exposure | The junction remained ohmic |
| Current–voltage, room-temperature air exposure after 20 % H2 exposure | The junction returned to a rectifying Schottky junction on an approximately 24 h timescale |
| Current–voltage, heating under H2-free CO2 or N2 after 20 % H2 exposure | The junction returned to a rectifying Schottky junction |
| Current–voltage, 4 bar(a) H2 at 250 °C | The junction returned to a rectifying Schottky junction on a longer timescale |
| Current–voltage, 2.75 bar(a) H2 at 70 °C | The junction became ohmic within 1 h |
| Current–voltage, 0.5 bar(a) H2 at 70 °C | The junction remained a leaky Schottky junction |
| Current–voltage, H2 diluted in CO2 compared with H2 diluted in N2 at the same H2 partial pressure | The change in junction shunt resistance was slower with CO2 |
| Current–voltage series resistance | 0.1–1 Ω |
| Current–voltage and Mott–Schottky, octadecanethiol-treated junction after H2 exposure at 70 °C and 0.5 bar(a) | Schottky barrier height decreased and dopant density increased |
| Current–voltage, dichloromethane-treated junction after H2 exposure | Large losses to the apparent Schottky barrier height continued |
| Current–voltage and Mott–Schottky, 1:1 N2–H2 with 7.3 kPa water vapour at 70 °C | No significant changes in Schottky barrier height or dopant density; dopant density was unaltered or decreased |
Ethan Shi, Arunavo Chakraborty, Alexis T. Bell, Neil K. Razdan, Shannon W. Boettcher. “Dynamic metal-semiconductor electrical interfaces in model Cu|ZnO hydrogenation catalyst structures.” ChemRxiv (). https://doi.org/10.26434/chemrxiv.15007475/v1